april 2008 rev 6 1/7 7 stps5l25 low drop power schottky rectifier features very low forward voltage drop for less power dissipation and reduced heatsink optimized conduction/reverse losses trade-off which means the highest efficiency in the applications high power surface mount miniature package avalanche capability specified description single schottky rectifier suited to switched mode power supplies and high frequency dc to dc converters. this device is especially intended for use as a rectifier at the secondary of 3.3 v smps units. table 1. device summary i f(av) 5 a v rrm 25 v t j (max) 150 c v f (max) 0.35 v 2 4(tab) 3 1 2 3 4 nc dpak www.st.com
characteristics stps5l25 2/7 1 characteristics table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 25 v i f(rms) rms forward current 7 a i f(av) average forward current t c = 145 c = 0.5 5 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 75 a i rrm repetitive peak reverse current t p = 2 s square f = 1 khz 1 a i rsm non repetitive peak reverse current t p = 100 s square 2 a p arm repetitive peak avalanche power t p = 1 s tj = 25 c 3000 w t stg storage temperature range -65 to + 150 c t j maximum operating junction temperature (1) 150 c dv/dt critical rate of rise of reverse voltage 10000 v/s 1. condition to avoid thermal runaway for a diode on its own heatsink d ptot dtj - -------------- 1 rth j a ? () ------------------------- - < table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case 2.5 c/w table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 350 a t j = 125 c 55 115 ma v f ( 1. ) forward voltage drop t j = 25 c i f = 5 a 0.47 v t j = 125 c i f = 5 a 0.31 0.35 t j = 25 c i f = 10 a 0.59 t j = 125 c i f = 10 a 0.41 0.50 1. pulse test: tp = 380 s, < 2%
stps5l25 characteristics 3/7 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) 0123456 0.0 0.5 1.0 1.5 2.0 2.5 if(av) (a) pf(av)(w) = 0.2 = 0.5 = 1 = 0.05 = 0.1 t =tp/t tp 0 25 50 75 100 125 150 0 1 2 3 4 5 6 if(av)(a) rth(j-a)=70c/w rth(j-a)=rth(j-c) tamb(c) t =tp/t tp figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 0 25 50 75 100 125 150 t (c) j p(t) p (25c) arm p arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance junction to case versus pulse duration 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 im(a) tc=25c tc=100c tc=75c t(s) i m t =0.5 1.0e-4 1.0e-3 1.0e-2 1.0e-1 1.0e+0 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-c)/rth(j-c) = 0.1 = 0.2 = 0.5 single pulse t =tp/t tp
characteristics stps5l25 4/7 figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) 0 5 10 15 20 25 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 3e+2 ir(ma) tj=125c tj=25c tj=150c vr(v) 12 5102030 100 200 500 1000 2000 vr(v) c(pf) f=1mhz tj=25c figure 9. forward voltage drop versus forward current (maximum values) figure 10. thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board fr4, copper thickness: 35 m) ifm(a) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 1.0 10.0 100.0 vfm(v) typical values tj=150c tj=125c tj=25c 0 2 4 6 8 101214161820 0 20 40 60 80 100 s(cu) (cm2) rth(j-a) (c/w)
stps5l25 package information 5/7 2 package information epoxy meets ul94, v0 in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at www.st.com . figure 11. dpak dimensions figure 12. foot print dimensions (in millimeters) ref dimensions millimeters inches min. max. min. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.003 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2 6.7 6.7 3 3 1.6 1.6 2.3 2.3
ordering information stps5l25 6/7 3 ordering information 4 revision history table 5. ordering information order code marking package weight base qty delivery mode stps5l25b-tr stps5l25b dpak 0.30 g 2500 tape and reel table 6. document revision history date revision changes jul-2003 5a previous release. 15-apr-2008 6 reformatted to current standards. corrected order code in ta b l e 5 .
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